HPPC TECHs Blog
Sekisui Mobility Solution - Safety(ADAS)-
The SEKISUI CHEMICAL Group provides materials that contribute to improving the reliability of ADAS devices, especially the bonding, heat dissipation, and molding technologies we have developed over time.
Challenge
With the evolution of ADAS (Advanced Driver-Assistance Systems), vehicles are being equipped with more and more electronic parts that work to achieve driver safety and comfort, and with this, a range of new issues are cropping up.
For example, we need methods to combat heat in order to prevent safety or performance drops due to the heat generated as electronic parts become more advanced and smaller, and to prevent operation errors due to interference from electromagnetic noise. So, there are increasing needs for heat dissipation and electromagnetic shielding in the materials that make up devices.
In particular, there is a strong demand that the performance, safety, and reliability of sensors parts such as radars and cameras that detect what is going on inside and outside the vehicle, and the ECU (Electronic Control Unit) that processes and judges information, be upgraded.
In addition, the increase in weight with these added parts means that even as vehicle electrification advances, there are impacts on range, so combining these parts with lightness is a key element.
Solution
The SEKISUI CHEMICAL Group provides materials that contribute to improving the reliability of ADAS devices, especially the bonding, heat dissipation, and molding technologies we have developed over time.
Our lineup includes greases and sheet-type heat dissipation products that allow cooling for hot parts such as CPUs and GPUs, and housings for millimeter wave radar or in-vehicle cameras, allowing us to offer materials that combine flexibility, insulation, and are siloxane-free.
In addition, for thin noise-absorbing materials that use our sputtering technology and injection-molded products that balance heat dissipation with electromagnetic shielding, we have the technologies to lighten materials or parts by replacing the conventional metal or rubber parts.
Also, we shall contribute to improving the reliability of ADAS devices through sealing functions using bonding technology and gap control for PCBs (Printed Circuit Board) that are getting thinner through functional microparticles technology.
Product list
A list of 12 items within the safety (ADAS) category.
Thermal-conductive greases CGW® series
Two-component silicone-based thermal conductive grease curing in room temperatureManion HST - high property, high thermal sheet -
Thermal conductive sheet with high thermal conductivity, flexibility and adhesionInjection molding with thermal-conductive and EMC shielding
Injection molding with high shielding and heat release properties achieved by our proprietary material technology1-Part Heat-Curable Grease
Thermal-conductive paste with heat dissipation, adhesion and insulation propertiesMillimeter wave absorbing sheet - masa sorb -
Millimeter wave absorbing sheet for radar with wide bandwidth, wide angle, and high absorption performanceFunctional fine particles - Epowell GP series -
Heat-curable adhesive containing ultra-uniform particlesFunctional fine particles - Micropearl SOL -
Solder balls with a polymer core for solder paste substitutionSolder anisotropic conductive paste - SACP -
Anisotropic conductive paste enabling metal bonding at low-temperature and low-pressureSELFA - high adhesion easy removable UV tape -
UV irradiated release tape specializing in heat resistance, chemical resistance, and easy peelingUV curing adhesive Photolec A
UV-curing adhesive with no oxygen inhibition and excellent reactivityUV curing adhesive Photolec E
UV delayed curing adhesive that can be applied to UV-impermeable materials and UV-sensitive surfacesTo explore additional categories, please click below.
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