- Mobility
- Electronics
- Sustainability
Waterproof/Shock-Absorbing Foam Tape 5200 Series
A heat-resistant foam tape that delivers both waterproofing and shock absorption
A functional foam tape made from a PE or PP resin foam substrate combined with a high-adhesion adhesive. It provides excellent waterproofing, dustproofing, and impact absorption, while also offering outstanding conformability to uneven surfaces. Ideal for cushioning and bonding applications in precision devices such as smartphones and in-vehicle displays, it maintains reliable adhesion even under high temperatures and complex shapes.
- Mobility
- Electronics
- Adhesion to heat-generating parts and complex shapes
- Double-faced tape with both heat resistance and flexibility
- Technical information
- Document download


Adhesion to heat-generating parts and complex shapes
As on-board electronic devices and their processing capabilities evolve, the functions and roles of on-board displays are also evolving. One such display is the head-up display (HUD). By putting the display function on windshields and other areas, the necessary information such as vehicle speed, directions, and alerts can be obtained without having to significantly change one’s driving posture and line of sight, which is expected to enhance driving safety. Consequently, the displays and projectors themselves need to be highly accurate, reliable, and durable.
With advanced driver assistance systems (ADAS) continuing to evolve, center information displays (CIDs) now offer entertainment in addition to conventional navigation and air conditioning functions, and feature more sophisticated designs and are becoming larger in size. On the other hand, when it comes to the component mounting process, it calls for heat-resistant property to attach devices that generate heat and adhesion to handle complex shapes and vibrations.

Double-faced tape with both heat resistance and flexibility
The 5200 series uses heat-resistant polyolefin foam as its base material, making it a double-faced tape that is both heat-resistant and flexible.
The 5200 series enhances the reliability and durability of electronic devices with its flexible base material and strong adhesion enabling applicability to curved surfaces, and its cushioning property reduces the impact on the components.

Technical information

Technical overview
125°C heat resistant
Low thermal shrinkage
Achieves 125°C heat resistance (shrinkage of 3% or less) by using a foam substrate made of heat-resistant polyolefin resin.
Strong adhesion
Resin formulation techniques
Demonstrates high adhesive strength due to unique formulation using acrylic adhesive compounding technology.
Surface following
Softness and adhesion tech
Flexible base material and adhesive material of our own composition realize excellent curved surface followability.
High flexibility
Soft and strong foam base
High flexibility is achieved by using a flexible, high-strength special polyolefin resin as the base material.
Technical details
125°C heat resistantDeformation of the adherend is limited to 3% or less at 125°C,
preventing tilt and displacement of the adherend.


Strong adhesion
180° peel strength 

Surface following
No floating or misalignment occurs on adherends with curved surfaces.


High flexibility
Compression strength
per compression ratio (compression curve)
per compression ratio (compression curve)


Features
- Foam tape has strong adhesive strength and durability to absorb high impacts.
- Bond well onto uneven surface and excellent water and dust-proof capability.
- Provide excellent repulsion resistance and strong adhesion to bond to a curve surface of objects.
- Have a wide range of thicknesses, which makes it possible to respond to various design needs.
Applications

1For bonding a cover panel and a case
2For bonding a touch sensor panel(TSP), and a liquid crystal display module(LCM), and an organic light emitting diode(OLED)
3Laminating tape under the LCM module for shock absorption applications
Product lineup
| Grade | Characteristics | Thickness(μm) | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| 100 | 150 | 200 | 250 | 300 | 400 | 600 | 900 | 1100 | ||
| 5200NSB | Standard | 5220NSB | 5230NSB | 5240NSB | 5260NSB | 5290NSB | 52110NSB | |||
| 5200PSB | Strong Adhesion | 5215PSB | 5220PSB | 5225PSB | 5230PSB | |||||
| 5200NAB | Strong impact absorption | 5210NAB | 5215NAB | 5220NAB | 5225NAB | |||||
| 5200VCB | Excellent impact absorption | 5215VCB | 5220VCB | 5225VCB | 5230VCB | |||||
| 5200VEB | Extraordinary impact absorption | 5220VEB | 5225VEB | 5230VEB | ||||||
Others
Impact test 【Result of a drop impact test】
Results on how easily each type of the sample tapes peeled off due to drop impacts.


1Cut a 3-inch squuare out of the sample tapes with a width of 2mm and 3mm respectively, and stick each of them to a PC board with its center cut. After that, apply a pressure of 5kg to it for 10 seconds.
2Leave the board at the normal temperature for one day, and drop a weight on its center to measure the height from the point where the weight was dropped to the point where the PC board peeled and fell off.
Adhesion test 【Push test】
With the center of a PC board cut out , adhesive strength of sample tapes is measured on the assumption that they are practicaly used.


1Stick a sample tape on the PC board with its center cut as the picture shows.
2Put an adherend on the tape with a weight of 5kg for 10 seconds. Do the same thing with other adherends.
3Leave it at the normal temperature for one day as the picture shows, and measure how much weight is needed until the adherend departs from the PC board by pressing it.
- The above figures are only measurements; their values are not guaranteed.
Document download
- All
- TDS
- Electronics
- Mobility
| Name | Type | File | Update | File |
|---|---|---|---|---|
| Catalog 〈Electronics〉:Waterproof・Shock-Absorbing Foam Tape 5200 Series | Electronics | 2025-09-30 | Download495.15 KB | |
| TDS:Waterproof・Shock-Absorbing Foam Tape 5200 Series | TDS | 2025-09-30 | Download1.34 MB | |
| Catalog 〈Mobility〉:Heat resistant foam tape 5200series_SekisuiMobilitySolution | Mobility | 2024-09-30 | Download1.15 MB |