UV curing adhesive PhotolecB
-Challenge- Improved adhesion with changes in material and shape
With advanced driver assistance systems (ADAS) continuing to evolve, center information displays (CIDs) now offer entertainment in addition to conventional navigation and air conditioning functions, and feature more sophisticated designs and are becoming larger in size.
Displays are becoming narrower in border size, more complex in shape, using increasingly composite materials, and larger in size in order to satisfy their design and multi-purpose needs. In terms of attaching components, there are challenges such as narrower lines, applicability to complex shapes, bonding different materials, and improving bonding strength, and using conventional tape to attach these components is becoming insufficient to meet these needs.
-Solution- Adhesives for fixing complex shapes and dissimilar materials
The UV (B stage) + moisture-curing adhesive Photolec B is a display edge adhesive that combines the strengths of a double-faced tape and an adhesive to provide both high-initial-bonding strength and reliability.
Its rapid activation of initial bonding strength eliminates the use of jigs and the need to maintain pressure.
With no glue overflow and a high degree of freedom in dispensing, it is capable of narrow side dispensing of 0.5 mm or less, making it suitable for bonding at narrow borders. It can also be used for bonding complex 3D curved surfaces, increasing the design flexibility.
Its excellent bonding property for different materials allows it to be used for various types of surfaces.
Its flexibility even after curing prevents warpage of components by stress relaxation.
-Technology- Technical information
Technical overview
High initial bonding strength
→ Improve production efficiency.
Can correspond to narrow side
dispensing below 0.5mm
freedom in dispensing.
→ Suitable for bonding at narrow borders.
3D curved surface bonding is also possible.
Suitable for bonding of
different materials
Increase design freedom.
Maintain softness after fully cured
the deformation of the adherend.
Technical details
High initial bonding strength
- No fixture required, pressure keeping
- →Improve production efficiency
- Shape retention
- →High degree of freedom of design
Can correspond to narrow side
dispensing below 0.5mm
No glue overflow + high degree of freedom in dispensing
→Suitable for bonding at narrow borders
3D curved surface bonding
is also possible.
Suitable for bonding of different materials
Maintain softness after fully cured
Can absorb the stress caused by the deformation of the adherend.
Document download
認定証ダウンロードファイル一覧
Name | Type | File | Update | File |
---|---|---|---|---|
Catalog:UV curing adhesive Photolec B_SekisuiMobilitySolution |
Catalog |
2023-09-11 |
Download
1.10 MB
|