UV curing adhesive PhotolecB

フォトレックB - UV(Bステージ)+湿気硬化型接着剤
UV + moisture-curing adhesive that combines the strengths of double-faced tape and adhesives

HMI functionality improvements
Product category Design/Comfortable

UV curing adhesive PhotolecB

-Challenge-  Improved adhesion with changes in material and shape

With advanced driver assistance systems (ADAS) continuing to evolve, center information displays (CIDs) now offer entertainment in addition to conventional navigation and air conditioning functions, and feature more sophisticated designs and are becoming larger in size.
Displays are becoming narrower in border size, more complex in shape, using increasingly composite materials, and larger in size in order to satisfy their design and multi-purpose needs. In terms of attaching components, there are challenges such as narrower lines, applicability to complex shapes, bonding different materials, and improving bonding strength, and using conventional tape to attach these components is becoming insufficient to meet these needs.

材料・形状の変化に伴う接着力向上

-Solution-  Adhesives for fixing complex shapes and dissimilar materials

The UV (B stage) + moisture-curing adhesive Photolec B is a display edge adhesive that combines the strengths of a double-faced tape and an adhesive to provide both high-initial-bonding strength and reliability.
Its rapid activation of initial bonding strength eliminates the use of jigs and the need to maintain pressure. 
With no glue overflow and a high degree of freedom in dispensing, it is capable of narrow side dispensing of 0.5 mm or less, making it suitable for bonding at narrow borders. It can also be used for bonding complex 3D curved surfaces, increasing the design flexibility.
Its excellent bonding property for different materials allows it to be used for various types of surfaces.
Its flexibility even after curing prevents warpage of components by stress relaxation.

複雑形状・異種材料固定用の接着剤

-Technology-  Technical information

Technical information

Technical overview

 High initial bonding strength

No fixture required, pressure keeping.
→ Improve production efficiency.

 Can correspond to narrow side
dispensing below 0.5mm

No glue overflow + high degree of
freedom in dispensing.
→ Suitable for bonding at narrow borders.
3D curved surface bonding is also possible.
0.5㎜以下の細線塗布が可能

 Suitable for bonding of
different materials

Can improve the freedom of material selection.
Increase design freedom.
異種材料接着に優れる

 Maintain softness after fully cured

Can absorb the stress caused by
the deformation of the adherend.
硬化後も柔軟性を持つ

Technical details

High initial bonding strength

No fixture required, pressure keeping
→Improve production efficiency
Shape retention
→High degree of freedom of design

Can correspond to narrow side
dispensing below 0.5mm

No glue overflow + high degree of freedom in dispensing
→Suitable for bonding at narrow borders

3D curved surface bonding
is also possible.

Suitable for bonding of different materials

Maintain softness after fully cured

Can absorb the stress caused by the deformation of the adherend.

Document download

認定証ダウンロードファイル一覧

Name Type File Update File

Catalog:UV curing adhesive Photolec B_SekisuiMobilitySolution

Catalog

pdf 2023-09-11
Download 1.10 MB