UV curing adhesive Photolec E

In the processes of attaching camera modules, which are key components of in-vehicle cameras used in advanced driver assistance systems (ADAS), and organic light-emitting diode (OLED) displays used in center information displays (CIDs), some processes do not allow UV irradiation due to UV-impermeable or UV-sensitive materials being used in the surfaces.
Furthermore, water penetration from the bonding area, which can cause defects in these components, must be prevented, and especially for OLED panels, high-optical performance is required.

The UV delayed curing low-moisture-permeable adhesive, Photolec E, is a UV delayed curing adhesive that can be applied to UV-impermeable materials and UV-sensitive surfaces. 
With its delayed curing (adjustable from 5 to 20minutes) instead of curing immediately after UV irradiation, Photolec E can be used for processes that cannot be performed with immediate curing by UV irradiation.
Low-moisture permeability, contamination-resistant resin prevents contamination or water penetration from external factors.
With a wide range of product lineups, it is capable of offering a variety of solutions to meet the needs of each application.