Solder anisotropic conductive paste - SACP -
Mobility
-Challenge- Increased mounting difficulty due to smaller and thinner substrates
As packages and PCBs continue to become more sophisticated, more compact, and slimmer, the technologies required for mounting them have also become more sophisticated, including lower gaps to achieve higher speed and high reliability for resistance to high temperatures and high humidity.
In addition, as packages and PCBs become slimmer, the issue of circuit board warpage caused by high temperatures in the conventional high-temperature soldering method is becoming more apparent.
-Solution- Low-temperature, low-pressure metal joining
Solder Anisotropic Conductive Paste (SACP) is an anisotropic conductive paste that enables metal bonding at low temperature and low pressure.
Low-pressure and low-temperature bonding process (approx. 1MPa, 140°C × 10sec.) enables metal connection.
High reliability is maintained even in high-temperature and high-humidity environments.
Low-profile connection (0.1mm thickness or less) and fine pitch connection (150μm) are possible.
-Technology- Technical information
Technical overview
Low profile connection,
low pressure bonding
Pressure about 1MPa, 140 dgree×10sec
High reliability
Maintaining robust reliability performance even in
conditions of elevated temperature and humidity.
・Maintains low resistance.
Technical details
Low profile connection, low pressure bonding
Recommends condition
Pressure 1~3MPaTemperature more than peal140°C
Temperature more than peal140°C
Bonding time more than 10sec
High reliability
1. Resistance measurement after 85°C 85% test
2. Adhesion measurement after 85°C 85% test
Document download
認定証ダウンロードファイル一覧
| Name | Type | File | Update | File |
|---|---|---|---|---|
|
Catalog:Solder anisotropic conductive paste - SACP -_SekisuiMobilitySolution |
Catalog |
2023-09-11 |
Download
1.13 MB
|
