Solder anisotropic conductive paste - SACP -

Anisotropic conductive paste enabling metal bonding at low-temperature and low-pressure

Mobility
Electronics

Increased mounting difficulty due to smaller and thinner substrates
Low-temperature, low-pressure metal joining
Technical information
Document download

Increased mounting difficulty due to smaller and thinner substrates

As packages and PCBs continue to become more sophisticated, more compact, and slimmer, the technologies required for mounting them have also become more sophisticated, including lower gaps to achieve higher speed and high reliability for resistance to high temperatures and high humidity.
In addition, as packages and PCBs become slimmer, the issue of circuit board warpage caused by high temperatures in the conventional high-temperature soldering method is becoming more apparent.

Low-temperature, low-pressure metal joining

Solder Anisotropic Conductive Paste (SACP) is an anisotropic conductive paste that enables metal bonding at low temperature and low pressure.
Low-pressure and low-temperature bonding process (approx. 1MPa, 140°C × 10sec.) enables metal connection.
High reliability is maintained even in high-temperature and high-humidity environments.
Low-profile connection (0.1mm thickness or less) and fine pitch connection (150μm) are possible.