Functional fine particles - Epowell GP series -

As packages and PCBs continue to become more sophisticated, more compact, and slimmer, the technologies required for mounting them have also become more sophisticated, including lower gaps to achieve higher speed, uniform gaps for ensuring high reliability, countermeasures against circuit board warpage, and resistance to high temperatures and high humidity.

The Epowell GP series is a heat-curable adhesive formulated with ultra-precision spacers.
Uniform gap control contributes to improved gap retention and uniform adhesion.
This series is compatible with high-temperature environments, and demonstrates stable adhesive strength even in a high-temperature and high-humidity environment.
A wide lineup of particle sizes from 15 μm to 500 μm enables precise gap control.