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- Mobility
- Electronics
- Sustainability
Manion HST - high property, high thermal sheet - (Under Development)
- Mobility
- Electronics
- Chip performance degradation due to high temperatures
- High heat dissipation by magnetic field orientation technology
- Technical information
- Document download
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Chip performance degradation due to high temperatures
The advanced driver assistance systems (ADAS) devices needed for automated driving use powerful CPUs and GPUs.
As the amount and speed of information processing increases, the temperature of the chip rises, causing a significant drop in performance.
Materials that can withstand high-temperature environments and dissipate heat efficiently are in demand.
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High heat dissipation by magnetic field orientation technology
By applying our unique magnetic field orientation technology, we have succeeded in producing a thermal conductive sheet that allows optimal use of the high-thermal conductivity of carbon fiber without sacrificing the flexibility and adhesive performance of the polymer.
This product is ideal for cooling high-heat sources such as CPUs and GPUs.
MANION-HST is a very thin sheet and can be used as an alternative to grease.
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Technical information
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Technical overview
High thermal endurance
-40℃ ~ 200℃
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Extremely low thermal resistance
Carbon fiber +
Magnetic field orientation technology
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High physical strength
Designed to withstand high pressure
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Thin design
Extremely thin 0.12mm~
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Technical details
High thermal endurance
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Extremely low thremal resistance
contributes to grease substitution
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High physical durability
Existing product | MANION-HST | |
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240 psi | ![]() |
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1,000 psi | ![]() |
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Thin design
Extremely thin, from 0.12 mm
Thickness adjustment according to design
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Document download
- All
- Catalog
Name | Type | File | Update | File |
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Catalog:Manion HST - high property, high thermal sheet -_SekisuiMobilitySolution | Catalog | 2023-09-11 | Download1.32 MB |